Business perspectives on MCM, MEMS and MEOMS packaging

This paper discusses business and product level considerations for multichip packaging, micro-electro-mechanical systems (MEMS) and micro-electro-optical-mechanical systems (MEOMS) as cost effective alternatives in the design and manufacture of communications systems and telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. MCMs, MEMS and MEOMS offer unique solutions and significant system level cost savings in many applications, e.g. RF modules, antennae tuning, digital matrix functions, optical switching and product options such as security, data storage, voice recognition, etc.