On-Chip Generation Method of Shock Load and Characterization of Microstructure Shock Process

Different from the device-level research on MEMS shock reliability, this paper introduces an on-chip generation method of shock load, which realizes the in-situ shock test directly loaded on the microstructure. To achieve energy storage and rapid release, a crossbow-type shock load generating structure that can integrate the test sample is proposed. The shock behavior is characterized by the high-speed camera, and the simulation model is established by the finite element software LS-DYNA. Under the shock acceleration of more than 100,000 g, the high-speed switching waveform generated by the microscale mechanical shock was observed with an oscilloscope for the first time. And the shock contact process and the dynamic fracture process of single-crystal silicon (SCS) structures in less than $1\mu \text{s}$ were exhibited. This work has the potential to be used to evaluate the shock resistance reliability of MEMS microstructures in mechanical shock environments, as well as to study material dynamic properties and material failure behaviors at the microscale. [2022-0076]