Average Power Handling Capability of Microstrip Lines Considering Heat Convection and Self-Heating Effects With Temperature-Dependent Resistivity

In this article, the average power handling capability (APHC) of microstrip lines is studied which considers both the heat convection and self-heating effects (SHEs) with temperature-dependent resistivity. A modified parallel-plate model (MPM) is developed to improve the prediction accuracy of APHCs. First, an effective thermal conductivity is used as correction in the original parallel-plate model. After that, the impact of heat convection on the microstrip line is combined in MPM, which matters in realistic situations. Finally, MPM is extended to account for SHEs of metal lines with temperature-dependent resistivities. For validation, APHCs of several microstrip lines with different dielectric substrates are investigated. The results agree well with those simulated by the commercial multiphysics solver, which confirms the validity and accuracy of the model.