A Bulk-Micromachined Resonant Differential Pressure Microsensor Insensitive to Temperature and Static Pressure

This paper presents a bulk-micromachined resonant differential pressure (DP) microsensor featured with a low temperature (T) and static pressure (SP) sensitivity. The developed microsensor was fabricated based on bulk-micromachining (e.g., deep reactive-ion etching and anodic bonding) and low-stress packaged based on metal bonding. Benefit from low-stress packaging and the application of metal bonding in packaging, the temperature sensitivity and static pressure sensitivity of the microsensor was decreased dramatically compared to the state of art. Furthermore, the frequency stability was improved by 39 times compared with non-stress-isolated microsensor based on epoxy bonding.