Corner Analysis of Manufacturing Tolerances of 5G mmWave Antenna in Package/Module (AiP/ AiM)

This paper discusses the impact of manufacturing tolerances on the performance of mm Wave (millimeter-wave) AiP through simulation. From the designed DOE (Stacked Patch size, Feed distance, p.p. and Core thickness) shows the important influence of component size. The stacked patch size is reduced by 25 µm (1%), the resonant frequencies are shifted to high frequencies by 0.3 GHz. The p.p./core thickness is reduced by 30 µm (11%/12%), the resonant resonances are moved to the high frequency 0.2 GHz. According to the DOE of each element on the mm Wave AiP, the impact of stacked patch size, p.p. and core thickness on AiP performance is more important and requires special attention. Understanding the key factors that affect component performance and ensure that the manufacturing process meets expectations. The deviations between design and measurement of the 1^st and 2^nd resonant frequencies are both less than 0.1 GHz. The measurement results are in line with expectations.