Evidence-Based Modeling of Thermal Processes in Printed Circuit Assemblies of Optoelectronic Devices

In this paper, the concept of “evidence-based modeling” is introduced. The authors understand it as a scientific approach to the practice of optoelectronic devices (OED) designing, in which design decisions are made based on the results of computer modeling of physical processes using well-known, repeatedly used programs with experimentally confirmed modeling errors. The authors show that the effectiveness of computer modeling is to reduce the time and cost of the overall development cycle of the OED with the given output technical characteristics, while ensuring high accuracy and reliability. These characteristics of the OED quality must contain reasonable reserves for electrical, thermal, mechanical and other physical loads on electrical radio elements and on supporting structures. The most important characteristics are the load factors in terms of electrical power and temperatures of the electrical radio elements cases for high-precision OEDs built into ground and on-board radio-electronic equipment. In this paper, we will consider the evidence of computer thermal modeling using well-known programs. This is demonstrated by examples of ASONIKA-T and ASONIKA-TM programs.