300 mm factory automation experience and challenges for wafer foundry fabs

As the semiconductor industry increases interest in 300 mm wafer size transition, Taiwan Semiconductor Manufacturing Company (TSMC) is also participating in the 300 mm development and mass production. TSMC uses a pilot line of 4.5 K monthly output capacity to gain process and tool expertise and to develop appropriate 300 mm factory automation know-how for the set-up of the next mass production 300 mm fabs. The goal is to achieve or exceed the current 200 mm foundry service, which offers leading edge technology, good on-time delivery, and excellent product quality for 300 mm fabs. A lot of experience has been learned and some challenges have been identified after operating this 300 mm pilot line for one year. These experiences and challenges are discussed in this paper.