Rapid Assessment of Semiconductor Thermal Quality

The performance and reliability of an IC Package will be affected by die attach defects such as voids, cracks and delaminations. In this paper, a novel Thermal Quality Tester is presented. It allows for non-intrusive and non-destructive tests of the samples within a very short period of time. Thermal transient tests are used to determine the thermal impedance and structure function curves of the samples. The samples can then be binned according to their thermal performance. Thermal simulations of the samples are used to provide information for the binning process. The concepts for this tester will be presented along with test sample measurements.