Thermal Design of Sealed Electronic Equipment Structure based on Modular Technology

Electronic technology has made rapid progress, the function of electronic equipment is more and more complex, the degree of integration is also higher and higher, and the requirements for power and precision are also higher and higher. The purpose of this paper is to study the thermal design of sealed electronic back structure based on modular technology, hoping to provide a solution to the problem of heat dissipation. Firstly, this paper studies the theory related to thermal design and the required simulation software, simulation platform, based on which the radiator is designed. Then the thermal analysis and thermal design of the sealed electronic equipment are carried out, and the specific heat dissipation scheme is proposed and simulated. In the design of heat dissipation scheme, the heat transfer model of fin, heat resistance network of power device, heat pipe and heat conduction plate are mainly designed. In the aspect of simulation analysis, it focuses on whether the simulation results of the whole machine model and the heat conduction plate meet the requirements of thermal design. Finally, according to the analysis results, the heat dissipation scheme of each part of the radiator is determined. According to the simulation analysis in this paper, the temperature of P chip is 75.2℃, which is similar to the calculated value of 73.5℃ , and the power supply temperature of power module is about 78℃, which meets the thermal design requirements. Therefore, it is determined to install heat pipe radiator and heat conducting plate on the main heating components, and adopt the cooling scheme of forced air cooling plate on the whole machine.