Measurement of PCB deformation during parametric testing and evaluation of the impact on the installed components

Using the IPC / JEDEC-9704 and KEMET-MLCC (Multilayer Ceramic Chip Capacitors) Fex Failure Rate standards is a defined area of critical deformation in parametric testing of circuit boards. An intelligent measuring system was used to measure and determine the deformation, as well as a methodology for conducting experimental measurements. The results of practical studies of deformations in parametric testing of electronic modules on a panel for a specific automotive product are presented. A conclusion is made using the obtained results with conclusions about the acceptability of the process according to the standard and analysis of the transients in parametric testing.