Simulation Study on Thermomechanical Reliability in Embedded Die Package Fabrication Process

EDP (Embedded Die Package) is promising in future years to become the key technology for power electronics because of its compact layer structure fulfilling integration requirements, its minimized parasitic effect with enhanced power conversion efficiency, as well as its benefits in shielding and thermal dissipation. Understanding the new elements presented by EDP and assessing their individual and collective impact on reliability are keys to successfully launching this new packaging technology into applications. Simulation works in this research present a detailed layer stacking fabrication process with risk causes analysis at each assembly step, with status tracking for each component, and with timing highlighted for risk presence. ANSYS Workbench has been utilized as the simulation tool, birth & death elements technique and thermal loadings have been properly applied on corresponding assembly procedures. Different with typical study solely focusing on component local behavior, a complete fabrication process has been considered with corresponding model established for each assembly step in this study, which enables us to investigate each single component on global package stand of view, and to discover mutual impacts between spatially neighboring components, as well as to explore the interactions between related components regarding assembly procedures. Based on simulation data, assessment on final products reliability is achievable. Models and results in this study could be references for further structure or layout optimization, material selection, and process plan modification. The analysis approach regarding multi-step multi-elements fabrication procedures could also be expanded to explore units and cases with similar 3D integration process flow.