High-Performance Flexible and Printed Electronics Based on Inorganic Semiconducting Structures

The transfer and contact printing methods have recently gained huge attention to integrate nano to chip (macro) scale inorganic structures over soft flexible substrates. This paper gives an insight into the mechanism of printing and development of high-performance flexible electronic devices from assembly of inorganic semiconducting structures of various dimensions using above-mentioned printing techniques, including nano (nanowires (NWs), nanoribbons (NRs), etc.), micro (microwires), and the chip scale (ultra-thin chips (UTCs)). These simple fabrication strategies have opened new avenues for high-performance printed electronic on large area flexible substrates.