Increase in EMI of module connectors due to the presence of intervening geometry

This paper examines the EMI effect of intervening geometry inside an electronics enclosure. Often, when examining the EMI ramifications of a modules-on-backplane enclosure, one examines the geometry of the backplane and PCB modules. However, the physical proximity of conductors such as stiffeners, partitions, and brackets can affect the emissions of the overall enclosure. This specific condition is examined using both a full-wave electromagnetics simulation and measurement of a simple enclosure.