Lidded Electronic Package with Boiling Enhancement Features

High-performance CPU/GPUs witness increasing power driven by demand of high-performance computing and cloud computing. The server packages are typically assembled with lids on top of silicon die or chiplets driven by structural integrity and heat spreading requirements. To address increasing risk of microelectronics cooling, two-phase immersion cooling attracts more attention by utilizing liquid-to-vapor phase change. In this paper, a new lidded electronic package with boiling enhancement features is proposed and compared to one without. The results showed improvements in cooling performance over standard lidded electronic package (40% reduction in thermal resistance and 50% increase in power dissipation capability). Based on the experimental results, the proposed enhancement approach holds promise for application in two-phase immersion cooling.