Characterization of a New Hybrid Thermally Conductive and EMI Absorber Material

These days’ electronics tend to work at higher frequencies while being enclosed in smaller and smaller casings, housings and devices. This seems to be the trend for the following years and leads to a concentration of electronics, which get hot, in small and close enclosures and, therefore, it is becoming really important to have a good Thermal Management. It seems easy to solve this problem by creating apertures, implementing heatsinks and so on, but, these electronics working at high frequency are very susceptible to create Electromagnetic Interferences (EMI) and, at the same time, sensitive to malfunctions when receiving noise. This contribution focuses on the analysis of a new hybrid Thermal Conductive and EMI Absorber Material intended to act as a bridge between EMI Shielding and Thermal Management components.