Modeling and Thermal Analysis of Cooling Solutions for High Voltage SMD Packages

In this work, an experimental investigation on thermal behavior of TO-LL, D2PAK, and H2PAK surface- mount device (SMD) packages is presented, by considering different number of PCB layers, different copper pads number and thickness, and thermal vias number and diameter. Moreover, an effective thermal equivalent circuit model has been investigated and validated with the experimental measurements, obtaining a good compromise between accuracy and computational burden.