Ultra-thin Image Sensor Chip Embeded Foil

Hybrid Systems in Foil (HySiF) is an integration concept for high-performance and large-area flexible electronics. The technology allows for integrating ultra-thin chips and widely distributed electronic components, such as sensors, microcontrollers or antennas, in thin flexible polymer film, using CMOS-compatible equipment and processing. This paper focuses on the embedding and characterization of a bendable ultra-thin image sensor in flexible polymer foil.