Surface Modification of Tetra-needle like ZnO (T-ZnO) and Characterization of Interface Between Sn1.0Ag0.5Cu and NiO Decorated T-ZnO

In this study, a novel SnAgCu lead free composite solder was prepared with ultrasonic casting. Tetra-needle like ZnO (T-ZnO) was chosen as the reinforcement due to the spatial three-dimensional structure, and surface modification was conducted to the T-ZnO with the pyrolysis method based with self-assembly. The results showed that NiO nanoparticle evenly attached on the surface of T-ZnO. For the NiO/T-ZnO reinforced Sn1.0Ag0.5Cu composite solder, no gaps and no micropores were observed at the interface between the solder matrix and reinforcement, which suggested that this Sn1.0Ag0.5Cu/NiO/T-ZnO composite interface structure was well designed.