Development and Manufacture of the Memory Micromodule Based on 3D SIP Technology

Currently the miniaturization of finished devices is carried out through the use of the latest methods of microelectronic assembly such as PoP (package on package), SiP (system in package), 2.5D and 3D technologies, making it possible to combine various electronic components into one module. The article describes the process of developing a miniature storage device using new three-dimensional technology for microelectronic device integration. The design solutions of the information storage device include NAND Flash memory chips, specialized thyristor protection chip, and specialized bus data generator. The miniature data storage device is used for operational storage, reading, and writing of information as a part of onboard equipment exposed to environmental influences. The article illustrates the main steps and typical operations of creating a miniature storage device based on patented technologies, which allows reducing overall dimensions by several times.