Design of broadband Frequency Conversion Components based on SIP

This paper proposes a miniaturization design method of SIP-based broadband inverter components, built on AL2O3 ceramic substrate, using three-layer stacking and RF multi-layer transition design, to realize the more than 1GHz IF broadband frequency conversion transmission of Ku. Through the electromagnetic simulation of packing key components and thermal simulation of multilayer circuit boards with different material, it fully shows that the substrate interconnection technology using HTCC process can meet the indicator requirements of the frequency conversation components. This method provides a good support for the miniaturization system package of the next high-power device and lays the foundation for the system of the next generation RF front end.