Design Process & Methodology for Achieving High-Volume Production Quality for FOWLP Packaging

With the economics of transistor scaling no longer universally applicable, the semiconductor industry is turning to innovative packaging technologies to support system scaling and functionality demands while achieving lower system cost. However, high-density packages such as fan-out wafer-level packaging (FOWLP) bring design challenges that traditional organic laminate processes and design tools struggle with and often fail to satisfy. In this paper, we address the challenges that FOWLP and similar high-density advanced packaging (HDAP) technologies bring to designers, outsourced semiconductor assembly and test (OSAT) suppliers, and foundries, and explain why traditional design processes, flows and even design tools struggle and often fail to achieve high-volume production. We discuss the innovative processes and design techniques that must be adopted not just to comply with design requirements, but to do so in a reliable, productive way to achieve high-quality results that meet manufacturing volume yield expectations. We discuss the processes and design flow Mentor developed through partnerships with leading foundries and OSATs, and how they are being used to drive high-volume production.