Flexible Piezo-Mems Fabrication Process Based on Thinned Piezoelectric Thick Film

High-temperature sintering is critical fabrication process for piezoelectric ceramics to reach a high quality. Generally, the sintering process is not employed in the fabrication process of piezoelectric thin film due to the low melting temperature bonding components or substrates. Piezoelectric thick film process based on mechanical thinning technology is becoming a key technology to develop high-quality piezoelectric ceramics in piezo-MEMS devices. Here, piezoelectric film transferring process, bonding process and laser cutting technology are employed for the flexible piezo-MEMS fabrication process, which is promising to develop high performance flexible piezo-MEMS devices, such flexible piezoelectric tactile sensors, flexible piezoelectric energy harvesters or flexible piezoelectric pressure sensors.