Contact Resistance Behavior of Land Grid Array Sockets at Cryogenic Temperatures Required for Quantum Measurements

The current state of quantum device maturity proposes the use of removable, reusable interconnection means between such device and their classical microelectronic measurement system. One such means is a land grid array (LGA) socket, used pervasively in microelectronics but relatively untested at cryogenic temperatures necessary for most quantum technologies. This article investigates two distinct commercially available LGA socket technologies with respect to contact resistance performance under cryogenic temperature measurement conditions. Test methodologies were successfully developed for both sockets, demonstrating predictable and repeatable contact resistance values during multiple excursions down to 1.5 K and a single excursion to 10 mK. The experimental data show that contact resistance of individual interconnection sites decreased from 30 to 40 mΩ at room temperature to 14-17 mΩ at 1.5 K and to 6-8 mΩ at 10 mK, thus supporting their reliable use in cryogenic measurement applications. Theoretical calculations based on the construction of the microspring socket validated that measured values behaved in a manner that was consistent with temperature-dependent changes in resistivity of the metals comprising the socket interconnection. Spring deflection allowances compensated for any temperature-driven movement of components within the assembly, thus enabling predictable resistance behavior. Regarding the elastomer socket, the high coefficient of thermal expansion (CTE) of the elastomer bulk material induced large variations in socket compression across the temperature range investigated. Sufficient compression to provide consistent contact resistance values at cryogenic temperatures imposed the need for very high compression at room temperature, which may place into question the longer term integrity of this solution. Nevertheless, a preliminary investigation (five cryogenic cycles and subsequent construction analysis) did not reveal any degradation in either socket type.