Flip-chip flex-circuit packaging for power electronics

The development of high-density packaging for power electronics applications has been driven by the requirement for system functionality enhancement and cost reduction. In this paper we explore a novel power packaging concept, the flip-chip flex-circuit package, that eliminates bond wires and exhibits potential for high-level component integration with an established flex-circuit technology. A baseline power electronic module involving a half-bridge circuit has been fabricated and evaluated electrically.