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A new analytical thermal model for multilevel ULSI interconnects incorporating via effect

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Ting-Yen Chiang; K. Banerjee; K.C. Saraswat
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Abstract:

This paper presents a compact analytical model for estimating the temperature rise of multilevel ULSI interconnects incorporating the via effect. For the first time, an a...Show More

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Abstract:

This paper presents a compact analytical model for estimating the temperature rise of multilevel ULSI interconnects incorporating the via effect. For the first time, an analytical expression is derived for the via correction factor, /spl eta/, which quantifies the effect of via separation on the effective thermal conductivity of ILD (inter-layer dielectrics), k/sub ILD,effective/, with k/sub ILD,effective/=k/sub ILD//k/sub ILD,effective/, where 0
Published in: Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461)
Date of Conference: 06-06 June 2001
Date Added to IEEE Xplore: 07 August 2002
Print ISBN:0-7803-6678-6
DOI: 10.1109/IITC.2001.930027
Conference Location: Burlingame, CA, USA
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