The Use of a Multilayer Substrate for a Small Directional Coupler

The aim of the work is to model and study a planar coupler whose dimensions are reduced due to the use of a multilayer printed circuit board and artificial transmission lines. The development of modern methods for the manufacture of printed circuit boards allows the development of complex devices on a printed circuit board. Selection of the optimal parameters of the artificial lines and their successful location in several layers of the substrate allows us to achieve compact dimensions and the smallest changes in the characteristics of the couplers. Using the Cadence AWR program, a coupler prototype was designed and then manufactured, whose area was reduced by 87.5%.