Plasma-Assisted Deposition of Dielectric Conformal Coating Using Hexamethyldisiloxane as Precursor

Plasma polymerization is a rapidly growing field of plasma technology. Using this method, it is possible to solve applied problems, for example, the deposition of conformal dielectric coatings to protect electrical circuit boards operating in outer space. In this paper, we study the vapor deposition of hexamethyldisiloxane using low-pressure plasma. The morphology, dielectric strength under plasma, and chemical composition of the deposited coating are studied. It was established that the coating has a lamellar structure, which, together with the data of IR spectroscopy, indirectly prove the formation of a polymer coating. The dielectric strength of the coating under plasma was 650 V.