Adhesion of Copper Surface Treated by Runaway Electron Preionized Diffuse Discharge

Runaway electron preionized diffuse discharge was used for copper surface modification. It was shown, that the roughness Ra value for the copper decreased from 21.5 nm to 17.7 nm, and adhesion measured by means of X-cut test (ISO 16276-2:2007) increased in two times after exposure to 40000 discharge pulses.