Photonic Integrated Circuits from Small Batches to Volumes: Standardization and Automation of Test

Scaling up Photonic Integrated Circuits from prototyping and small batch fabrication to volume production requires revision and improvements of many processes across the full manufacturing chain. These efforts include automation and standardization of electronic-photonic test processes, tools and methods. Recent developments of automated, prepackaging die test services, carried at Photonic Integration Technology Center and TU/e as a part of European pilot lines, PIXAPP and InPulse will be presented.