Research on low-temperature glass sealing of 50%Si/Al shell

In view of the problems in the brazing process of the Radio frequency (RF) microwave channel in Si/Al packaging shell, the technical requirement of low-temperature glass sealing of Si/Al packaging shell was analyzed. The feasibility of the glass material with low sealing temperature, low expansion coefficient and low dielectric property was proved by theory and experiment. The single glass material could not meet the requirement of low temperature sealing and radio frequency transmission. Therefore, the composite glass insulator of DM305 high-temperature glass column with low-temperature glass ring wrapped was designed. The low sealing temperature, low expansion coefficient and low dielectric constant can be obtained by this composite structure. The sealing structure is compatible with the plating and packaging process of 50%Si/Al Shell, which is suitable for engineering application.