Research on the board level reliability of CQFP package with 0.40mm pitch

In this paper, the thermal fatigue life of welding spot of 0.40mm pitch CQFP ceramic package is studied by finite element method. The simulation analysis of board level mechanical impact and random vibration test is carried out. This thesis is focused on the influence of lead support height, width and thickness on the reliability of solder joints and the stress and strain distribution of solder joints under different test conditions, which provides a theoretical basis for the board-level reliability design of 0.40mm pitch CQFP ceramic package. At the same time, we use the special test board to make the board-level installation and the simulation results of relevant mechanical and temperature tests were verified. After the board-level installation, the product met the reliability test requirements, and the use guide was formed to provide guidance for the subsequent new product design. Through the research, the simulation analysis and verification technology of board-level reliability of 0.40mm pitch CQFP ceramic package were mastered. The results show that increase the support height and decrease the lead width can effectively reduce the stress value and improve the solder joint reliability.