Study on the Low Temperature Reliability of Leaded Solder

This paper studied the low temperature tensile mechanical properties of Sn63Pb37, Sn62Pb36Ag2, In50Pb50, and Pb88Sn10Ag2 solders. It found that Sn62Pb36Ag2 solder still maintained a high post-break elongation at -150 °C compared with Sn63Pb37, and its low-temperature mechanical properties were more excellent. The dispersed β-Sn phase in the solder played a key role in strengthening the toughness. Compared with In50Pb50 and Pb88Sn10Ag2, It also showed better process applicability and maturity.