A collaborative optimization for floorplanning and pin assignment of 3D ICs based on GA-SA algorithm

In this paper, a collaborative optimization for floorplaning and pin assignment of 3D ICs using genetic and simulated annealing(GA-SA) algorithm is presented. Layout problem is usually solved by using multi-objective function optimization developed from stochastic optimization algorithm. The weight value of multi-objective function has great impact on the final layout results. A hybrid algorithm combined Genetic and Simulated Annealing(GA-SA) algorithm is developed to find the weight values in the co-optimization. By this method, area, interconnection length, maximum temperature of 3D floorplanning, and partial return-path inductance of signal pins and mutual inductance of power/ground pins of pin assignment are well considered in the optimization procedure.