Implementing Photosensitive Glass as a Solution in Thermal Management Applications

Glass is being evaluated for several high frequency RF applications due to its insulative properties. Part sizes and critical dimensions can be significantly reduced without risking interaction between lines. Concerns arise in regard to using glass in high power, thermal, applications due to the fact that it is a poor conductor of heat. 3D Glass Solutions (3DGS) has a unique in-glass process that helps to circumnavigate this issue. Unique via shapes, with small diameters, can be placed very near one another to allow for the creation of high aspect ratio designs and a high density via array. By adding surface metallization, heat spreaders, heat sinks and sub-mounts can be created in small package sizes for the bulk cooling of electronic devices. Additionally, signal lines and circuit routings can be placed directly within and on the surface of a microfluidic chiller in order to increase and/or transport heat to different areas of the product. A pressurized cooling fluid can be pushed through the chiller, while still protecting the electronic signal I/O's within the part. This provides a positive outlook for small electronic cooling devices integrated into a single or multi-layer part alleviating concerns for negative thermal implications within the RF realm.