Thermal Expansion Phenomena and Influence on Damping Coeffcient and Stiffness Variation for MEMS Kinematic Quantity Microsensors and Microactuators

The objective of the paper is to present simulation results of microsensors with taking into consideration response of device caused by spring constants and damping coefficients variation as an effect of operating in variation temperature environment. Authors raised up this problem for both main types of microdevices - actuators and sensors. These microdevices can be a parts of large complex devices and can be mutually dependent - like in vibratory gyroscopes. Results are presented in terms of performance quantities like eigenfrequencies and Q-factors. Simulations presented by authors are oriented on analysis of particular types of geometries (like crab-leg, serpentine or double serpentine suspensions, comb structures and single/double inertial masses) in various configurations, dimensions and for specified device actuating/sensing directions (x, y or z). Finally, authors perform assessment, which parts are influenced by temperature variation the most and what it has an impact on total device operation. Results presented in this paper can be very helpful on device design stage and further geometry structure optimization.