Implementation of TGVs using nano-glass powder reflow process for leadless packaging

This paper reports a new implementation method of through glass vias using nano-glass powder reflow process. The nano-glass powder is fabricated using ball grinding. Both day and wet ball grinding are investigated to obtain nano size glass powder. The particle size distribution of nano-glass powder reached to 95.6% with wet ball grinding. The implementation of through glass vias is realized by filling nano-glass powder into fabricated silicon grooves with high temperature reflow process. The bonded strength of the reflowed glass has been measured to be over 7 MPa. Both large-plane groove and high-aspect-ratio groove can be effectively filled with 4 h vacuum heat insulation process at 1000°C. This method provides the new pathway for glass micromaching and leading packaging.