Wiring technology for upcoming generation power module

As the utilization field of power modules has been expanding, power modules will be required higher performance than current products. To achieve market demands, it is essential to develop wiring technologies which have impact on lifetime, package size and power density of power modules. Although Al wedge wire bonding technology has been conventionally using, lifetime of module is mainly influenced by the fatigue life of wire bonding junctions on chips and wire bonding areas often become a limitation to package shrink. To solve this matter we have developed novel inner wiring technologies such as applying new wiring material, direct lead bonding (DLB) technology to case type module.