LTCC PoP Technology-Based Novel Approach for mm-Wave 5G System for Next Generation Communication System

This paper presents a comprehensive 5G system design methodology targeting 1Gbit/s next-generation, cellular communication based on Low-Temperature Co-fired Ceramics (LTCC), Package on Package (PoP) solution for mm wave module at 28-GHz in 5G communication System. The tile type package contributes to a dramatic reduction in size of the 5G communication system in single package along with the obvious merit of ceramic housing, which is better consistency of Coefficient of Thermal Expansion (CTE), compared to the traditional combination of ceramic board and metal housing. In addition, the paper presents the schematic diagram of heterogenous integration into an LTCC package including MMIC and RFIC (TX/RX) and 5G modem package mounted on LTCC base package and proposes a novel vertical interconnection based on Ball Grid Array (BGA) to connect vias in the lid and those in the stage of the main LTCC pan. This transition provides excellent signal integrity at high-speed data rates up to 28 Gbits/s. The paper also investigates the timing budget of TX/RX (at 28GHz) mm-wave signals in PoP technology for integrating a MMIC, PMIC, RFIC and 5G modem IC on another package. It starts by examining the package electrical modeling methodology used in GHz I/O device modeling in a more robust and accurate way to support high-volume manufacturing and high signal quality. This is followed by frequency and time domain analysis of package models to determine the optimized design parameters to achieve good signal performance.