Ultra low profile thin film capacitor for high performance electronic packages

Thin film capacitor (Z-Leveler^®) has been developed with our unique technology to form dielectric thin film layer on metallic foil. This thin film technology allows Z-Leveler^® to have ultra low profile less than 50μm thickness with flexibility by using metallic foil as substrate and high capacitance density by using a fully crystalized barium titanate (BT) material as dielectric layer. In addition, Z-Leveler^® can have very low equivalent series inductance (ESL) less than 10pH, which leads keeping the impedance low in high frequency such as more than 100MHz. This Z-Leveler^® technology will lead a new electronic package concept by replacing the conventional embedding or surface mounting electronic component to have high performance and good power efficiency for high-speed communication and computing application.