Thick-films beyond the 1 GHz barrier

Thick-film technology has shown significant progress in interconnection density using photopatterning technology, lower dielectric constant and lower loss dielectrics, higher conductivity conductors and buried resistors and capacitors integral with the substrate. These advances coupled with thermal and reliability advantages of thick-films have created a new generation of thick-film technology suitable for many microwave designs. The paper reviews new thick-film materials and processes developed to extend the capability of conventional MCM-C technology in microwave applications.