Metal Stamped Antenna-in-Package for Millimeter-wave Large-scale Phased-array Applications Using Multiphysics Analysis

This paper presents a metal stamped antenna-in-package concept for enhanced cooling in millimeter-wave (mmWave) phased array systems. To verify the proposed AiP concept, the proof-of-concept (POC) model is designed and fabricated using standard PCB and metal stamping process. The fabricated POC model achieves -10 dB impedance bandwidth of 0.7 GHz with a center frequency of 28.5 GHz. Good agreement is achieved between the measured and simulated radiation patterns with the measured peak gain of 14.01 dBi. The effect of the fabrication error on EM properties is discussed to explain the difference between the simulated and measured results of the gain. The two-dimensional array is demonstrated to verify the feasibility for a practical application of mmWave Massive MIMO systems with main beam scanning range of ± 30° in both elevation and azimuth planes. Computational fluid dynamics simulation confirms that the proposed metal stamp AiP reduces the maximum surface temperature of the package by more than 11 °C.