Computer-aided design of mixed-technology VLSI systems

In this paper, we present specific CAD issues along with new point tools for design for reliability and manufacturability of mixed-technology VLSI systems. Reliability concerns have been rising for hot carrier induced degradation, oxide breakdown, electromigration, electrostatic discharge, and electrical overstress. In particular, we discuss electrothermal analysis of VLSI systems with emphasis on temperature-aware placement of modules and static timing analysis. Composite simulation of MEMS and MOEMS are also discussed.