Contacting of SMD Components on the Textile Substrates

This paper deals with contacting of the standard electrical SMD components on the textile substrates. SMD components are contacted and also encapsulated in one single step by a thermocompress method. SMD components are embedded and fixed in the cavities of the plastic housing made by 3D printer. This housing is subsequently melted by the standard thermo-transfer device, which is used in textile industry for pattern transfer. The electrically conductive track can be embroidered by a conductive hybrid thread directly on the textile or printed by conductive ink on the housing.