The Deposition of Thin Metal Films in Low Temperature Plasma of Hollow Cathode Glow Discharge

The article considers the application of low temperature plasma of hollow cathode glow discharge for a thin metal films obtaining on a glass substrates at a gas pressures of 1 to 100 Pa. The substrate - cathode distance varied in a range of 5…30 mm. The discharge current Id= 25… 100 mA, with the voltage on the electrodes fluctuating within 400… 800 V. It is shown that at a Cu film thickness of 0.5… 1.2 µm obtained under the given conditions, the adhesive strength fluctuates within 38… 32 MPa and decreases rapidly with further film expansion.