Reliability evaluation and selection of underfill adhesives

Along with the microelectronics technology towards miniaturization and multifunction, the reliability of electronic chips plays a vital important role. To solve the stress concentration issue during the chip package, we usually introduce the underfill modification beneath the chip. Therefore, choosing a proper underfill adhesive will impose great challenges to the chip reliability. In this paper, we discuss the four parameters that impact the performance and reliability of underfill adhesive, including the reliability of material, compatibility, technique and t equipment. Based on this detailed and systemic report of underfill adhesive, other companies can learn about how to choose and evaluate the underfill adhesive for a practical application.