Effect of random vibration load on flat cover and T-shaped cover in CCGA package

This paper uses the finite element method to establish a three-dimensional finite element model of a ceramic column grid array (CCGA) package flat cover and T-cover structure. The stress distribution of CCGA package sealing cover under three random vibration loads (acceleration root mean square values of 53.5 m/s²、92.6 m/s²、119.5 m/s²) is analyzed, and the flat cover and T-shaped cover are respectively determined. The dangerous position of the plate structure, the initial position of the crack and the crack propagation. The results show that the flat cover plate is prone to cracks at the four corners of the interface between sealing cover and solder, and the T-shaped cover plate is liable to cracks in the middle of the edge of the interface between sealing cover and solder.