Research on Vibration Failure of Solder Joints for Different Packaging Forms

With the rapid development of science and technology, electronic products are also developing towards high density and high integration. People have higher and higher requirements for the reliability of electronic products. The use environment of electronic equipment is getting worse and worse. For example, in the process of aircraft take-off, rocket launching, ground vehicles and warships in the field environment, they will be subjected to severe vibration impact. Various BGA board-level components loaded therein also subject to severe vibration shocks, which will aggravate the elastic-plastic deformation of solder joints and invalidate the solder joints of the PCB component, thereby preventing the entire electronic device from working properly. Therefore, in the study of solder joints fatigue reliability, in addition to the traditional low-cycle thermal fatigue needs to be considered, the vibration shock reliability is worthy of more attention. Different packaging forms have a great influence on the high cycle fatigue failure of solder joints and its fatigue life. This paper studies the failure of joints of Ceramic Ball Grid Array (CBGA ) and Plastic Ball Grid Array(PBGA) under random vibration conditions, and the stress of the solder joint array is analyzed, and their fatigue life under random vibration conditions is predicted and compared. According to the analysis, under the same vibration conditions, CBGA components are more susceptible to vibration deformation than PBGA components, and are more likely to fail.