Measurement-assisted extraction of PCB interconnect model parameters with fabrication variations

Measured S-parameters and cross-sections of PCB interconnects are used in this paper to identify parameters of electrical models suitable for statistical analysis of interconnects with manufacturing variations. The constructed models reproduce observed effects of geometry and material properties variations on the loss, delay and impedance, and are suitable for yield analysis of interconnects with up to 56 Gbps signals. This is the first attempt to build such models for PCB interconnects.