I. Introduction
Recent advances in materials and fabrication techniques have enabled the development of novel flexible electronics, soft sensors, and soft actuators [1]–[3]. Traditional printed circuit boards, rigid electronic components and batteries are also giving way to soft alternatives for various applications in soft robotics and wearable devices [4], [5]. This shift in hardware configurations has created challenges for electrical connections. Several soft systems are required to undergo large deformations while maintaining stable connectivity between various electrical components. Commonly used interconnections such as insulated conductive wires [6], [7], copper traces [8] and etched copper sheets [9] offer favorable electrical properties, but they are not flexible enough and can affect the structural properties of soft mechatronic components.