Yield and equipment utilization improvements achieved through fab conversion to carbon fiber/PEEK wafer carriers and carbon fiber/polypropylene storage boxes

Many semiconductor fabs using outdated wafer carrier technology are facing problems with carrier dimensional variation over time and particle generation. Carrier dimensional variation leads to excessive tool failures and wafer damage. This results in decreased throughput and yield loss. In addition, carrier particulation directly causes wafer defects, also negatively affecting yield. IBM-Burlington was encountering these problems and put a great deal of effort toward estimating yield loss and obtaining financial support to upgrade the carriers. After financial support was obtained, a customer/supplier team was formed to plan the conversion to an upgraded carrier and box. Significant improvements in yield and tool availability were realized with minimal impact on production during conversion.